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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 1/4 HSD471A NPN EPITAXIAL PLANAR TRANSISTOR Description The HSD471A is designed for use in drive and output stage of frequency amplifier applications. Absolute Maximum Ratings TO-92 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 800 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 40 V VCEO Collector to Emitter Voltage ...................................................................................... 30 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current............................................................................................................... 1 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) *VBE(sat) *hFE fT Cob Min. 40 30 5 70 Typ. 130 16 Max. 100 0.5 1.2 400 Unit V V V nA V V MHz pF Test Conditions IC=100uA, IE=0 IC=10mA, IB=0 IE=100uA, IC=0 VCB=30V, IE=0 IC=1A, IB=100mA IC=1A, IB=100mA VCE=1V, IC=100mA VCE=6V, IC=10mA VCB=6V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification of hFE Rank Range O 70-140 Y 120-240 GR 200-400 HSD471A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 VCE(s at) @ IC=10IB Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o Saturation Voltage (mV) hFE 100 75 C o 25 C 75 C o o hFE @ VCE=1V 125 C o 25 C o 100 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 o Capacitance & Reverse-Biased Voltage 100 25 C Saturation Voltage (mV) 125 C o 75 C o Capacitance (pF) 10 Cob VBE(sat) @ IC=10IB 100 1 10 100 1000 1 0.1 1 10 100 1000 Collector Current-IC (mA) Reverse Biased Voltage (V) Cutoff Frequency & Ic 1000 10000 PT=1ms Safe Operating Area Cutoff Frequency (MHz).. . Collector Current-IC (mA) 1000 PT=100ms PT=1s VCE=6V 100 100 10 10 1 10 100 1000 1 1 10 100 Collector Current (mA) Forward Biased Voltage-VCE (V) HSD471A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 3/4 IR Reflow Profile 260 240 220 200 250 10+/-2 sec 300 Temperature Profile for Dip Soldering 10+/-2 sec Temperature( C) Temperature( C) 180 160 140 120 100 80 60 40 20 0 0 50 100 150 200 250 300 150+/-30 40+/-20 sec o o 200 150 100 120+/-20 sec 50 0 0 50 100 150 200 250 300 350 Time(sec) Time(sec) Power Temperature Derating 900 800 PD , Power Dissipation (mW) 700 600 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ta , Case Temperature ( C) HSD471A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6518 Issued Date : 1993.02.24 Revised Date : 2002.02.20 Page No. : 4/4 2 Marking: H SD 471A Rank Control Code 3 C Style: Pin 1.Emitter 2.Collector 3.Base D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSD471A HSMC Product Specification |
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